Delo Industrial Adhesives developed special glob top adhesives with optimized flow properties for die coating, responding to increasing miniaturization in microelectronic packaging, allowing chips, for example MEMS sensors, to be coated in a uniform thickness of less than 100 µm that does not extend beyond the chip edges.
The Delo heat-curing acrylates have a low viscosity and special flow properties, and they can thus be processed efficiently by jetting, achieving a thin and homogeneous flat surface using just a few drops, on a wide range of chip sizes to be coated. A further benefit is the high flexibility, with shore hardness A60, that reduces the risk of stresses in chip and wires. In addition, the special black-colored adhesive not only protects and preserves the chip surface, but also covers its logistic structures, making it possibile to perfectly cover the chip corners where the layer is particularly thin.