Delo presents the electronic adhesive Delomonopox GE7985, a high viscosity adhesive featuring very thin and high walls responding to the increasing miniaturization in electronics in automotive and industrial applications. The adhesive has smaller fillers than previous products of the company’s ‘dam & fill’ range, allowing it to be applied with needles of a minimum diameter of 250 µm. Thanks to the high viscosity of 160.000 mPas, the adhesive provides high flow resistance and an aspect ratio of 2,5, allowing to realize an adhesive bead that can be more than twice its width, without the bead collapsing.
These characteristics make it perfectly suitable for finest structures such as high separating walls between sensors, and while stacking of bead layers, a technic known as ‘dam stacking’, it doesn’t require curing in between. Delomonopox GE7985 offers an extended service temperature range up to 200° C, and a coefficient of thermal expansion of 24 ppm/K, so that it keeps warping at a very low level. The black one-component product features low water absorption and very good chemical resistance to acids, oils and other aggressive media. The adhesive cures under heat, with variable conditions in terms of time and temperature (for example, 20 minutes at 150°C), and thanks to the flow resistance the aspect ratio doesn’t change while curing.