Simulation Ansys 10x improved

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The Ansys 17.0 release offers 10x improvements in the whole range of the simulation suite functionalities. The tighter integration of semiconductor and electronics simulation solutions enable a comprehensive chip-package-system design workflow, with new capabilities for automated thermal analysis and integrated structural analysis to deliver smaller and higher-power density devices in the sector of the internet of things.

The direct modeling tools of Ansys 17.0 enable to prepare geometries for analysis faster than traditional CAD solutions, with save and load times for complex models increased by up to 100 times. The suite also allows to be more productive with developing, testing and certifying embedded software, and introduces native support for the industry-standard system modeling language Modelica, enabling the access to hundreds of additional mechanical and fluid component models, in addition to its rich model library. At last, turbomachinery simulation capabilities have been greatly expanded, and all the product lines benefit from the most modern architectures of HPC solvers, delivering for example unprecedented computational speed for full transient electromagnetic field simulation, now completed in hours, helping to develope faster more efficient electric machines.

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