New E-Pack Tech event by Fiera Milano for the e-commerce in China

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Looking at the rapid growth of the e-commerce in the global market, Fiera Milano created the E-Pack Tech, a new event in China dedicated to technologies and packaging materials for e-commerce, in partnership with Ipack Ima. The exhibition will make its debut in Shanghai in October 2019, within CeMAT Asia, a reference event for China dedicated to internal handling, technological automation, transport and logistics systems.

E-Pack Tech is organized by Fiera Milano through Hannover Milano Fairs Shanghai, a Chinese joint venture with Deutsche Messe. The operation, supported by Ipack Ima, is aimed to consolidate and strengthen strategic sectors for the Italian industry, such as the instrumental machinery for the packaging industry. The exhibition will offer Italian and European excellence companies the opportunity to have an immediate and direct contact with the Cinese market, where the online commerce is already a solid reality with players such as Alibaba and JD.

With a turnover of € 7.2 billion in 2017 (source: Ucima), the industry of Italian manufacturers of automatic packaging machines is one of the fastest growing Italian industrial sectors, and China is the 5th target market for the export of Italian companies that produce packaging technologies. In the packaging industry, in particular, the impact of e-commerce has been significant: four out of ten companies manufacturing this type of machinery have received specific requests for the on-line trade channel (source: Osservatorio 2018 NETCOMM – IPACK-IMA).

E-Pack Tech belongs to the implementation of the Fiera Milano’s internationalization strategy, through the export of successful exhibition models outside the national borders, and follows the recent acquisitions of two fairs in China and one in Brazil which have helped strengthen the Group’s exhibition portfolio.

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